Dongguan Senshuo Technology Co., Ltd. is a professional manufacturer engaged in semiconductor silicon materials, crystal cutting, grinding and polishing. It was established in August 2010. The company currently has 40 employees, including 1 senior engineer and 3 senior technicians. The operating staff and management personnel in the production positions have more than 3 years of semiconductor wafer production experience. The company's main management and technical personnel have more than 20 years of semiconductor wafer production management experience.

The company adheres to the business philosophy of entrepreneurship, innovation, refinement and development, and has technical cooperation and business contacts with well-known domestic semiconductor companies such as Zhejiang Haina and Tianjin 46. In addition to producing its own products, the company also purchases silicon materials from companies such as Beijing Youyan Silicon and Hangzhou Haina, and then finishes them and sells them to customers. Customers who have business and established strategic partnerships with our company include Jiangyin Xinshun, Fujian Ante, Wuxi Huajing, Shenchao (Optical), Nanjing Wavelength, Hangzhou Meloc, etc., in addition to gaining a firm foothold in the semiconductor industry, they are also striving to enter the optical photoelectric sensor industry. This industry requires a huge silicon material market. Strive to establish the "Senshuo" brand in the semiconductor material industry and become the first domestic silicon material supplier in the optoelectronic industry. While doing a good job in the domestic market, the company attaches great importance to and explored overseas markets, and has developed silicon polishing wafer business with Taiwan, Singapore, Japan, etc., and continues to expand.

The cutting, grinding and polishing production lines owned by the company mainly produce and externally process various specifications of silicon monocrystalline cutting wafers, grinding wafers, single polishing wafers, double polishing wafers (Prime wafer, Test wafer & Dummy wafer), mainly including ￠1″, ￠ 2″, ￠3″, ￠4″, ￠5″, ￠6″ have a variety of specifications with thicknesses from 150μm or more. In addition, it also undertakes silicon etching wafer processing business. The company's production capacity reaches 200,000 wafers/month. The product quality is strictly in accordance with the GB/T12965-2005 standard. The company also has 5 internal cutting machines, one 200B chamfering machine made in Tokyo, Japan; 3 domestic chamfering machines; 2 9B double-sided grinding machines made in Lanzhou Ruide, China; wax polishing machine made in Lanzhou Ruide, China 5 sets, 18 sets of imported polishing machines, 1 set of semi-automatic cleaning machine, production environment cleanliness level 1000 400 square meters, cleanliness class 100 100 square meters. With the expansion of business scale, the company strives to introduce the requirements of the ISO9001:2015 standard into the business management of the company, and uses advanced management models to ensure product quality and fully meet the needs of customers and the market.